Process kit ring adaptor

ABSTRACT

A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.

TECHNICAL FIELD

Embodiments of the present disclosure relate to apparatuses and methodsfor process kit ring replacement in processing chambers, such as thoseused in wafer processing systems, and in particular to a process kitring adaptor for securing a process kit ring.

BACKGROUND

In semiconductor processing and other electronics processing, platformsare often used that use robotic arms to transport objects such as wafersbetween processing chambers, from storage areas (e.g., front openingunified pods (FOUPs)) to processing chambers, from processing chambersto storage areas, and so on. A processing system, such as a waferprocessing system, has one or more processing chambers for processing ofsubstrates. A gas may be used to etch a substrate in a processingchamber (e.g., a substrate may be etched while electrostatically clampedin position in an etch chamber). One or more process kit rings maysurround a substrate (e.g., to protect one or more portions of theprocessing chamber, the substrate, etc.). For example, a circular part,referred to as an edge ring or process kit ring, is positionedimmediately outside of the outer diameter of the substrate to protectthe upper surface of a chuck (e.g., an electrostatic chuck) supportingthe substrate from being etched by etchant chemistry. Process kit ringsare made from several different materials and can have different shapes,both which affect process uniformity near the process kit ring. Duringprocessing, process kit rings are etched over time and result in shapechanges as well as changes in processing uniformity.

To address the changes in processing uniformity due to process kit ringdeterioration, process kit rings are replaced according to a schedule.Conventionally, to replace a process kit ring, an operator opens aprocessing chamber to have access to the process kit ring inside,manually removes and replaces the process kit ring, and closes theprocessing chamber. While the processing chamber is open, the processingchamber and the processing system may become contaminated with cells,hair, dust, etc. The processing chamber and/or processing system thengoes through a requalification process that may remove the processingchamber and/or processing system from operation for days to weeks. Thisimpacts the line yield, scheduling, quality (e.g., responsive to addingvariables to the system), and so forth.

SUMMARY

The following is a simplified summary of the disclosure in order toprovide a basic understanding of some aspects of the disclosure. Thissummary is not an extensive overview of the disclosure. It is intendedto neither identify key or critical elements of the disclosure, nordelineate any scope of the particular implementations of the disclosureor any scope of the claims. Its sole purpose is to present some conceptsof the disclosure in a simplified form as a prelude to the more detaileddescription that is presented later.

In an aspect of the disclosure, a process kit ring adaptor includes arigid carrier. The rigid carrier may include an upper surface includinga first distal portion and a second distal portion to support a processkit ring. The rigid carrier may further include a lower surfaceincluding a first region to interface with an end effector configured tosupport wafers and a solid planar central region to interface with avacuum chuck.

In another aspect of the disclosure, a process kit ring adaptor includesa first reinforcement structure including a first distal end and asecond distal end for supporting a process kit ring. The process kitring adaptor further includes a vacuum interface structure, coupled to alower surface of the first reinforcement structure, forming a solidplanar lower surface to interface with a vacuum chuck.

In another aspect of the disclosure, a method includes lifting, using anend effector on a robot arm of a processing system, a process kit ringadaptor and process kit ring disposed on a first distal end and a seconddistal end of the process kit ring adaptor. A first upper surface of theend effector interfaces with a lower surface of the process kit ringadaptor. The method further includes placing, using the end effector,the process kit ring adaptor on a vacuum chuck. A planar central regionof the lower surface of the process kit ring adaptor interfaces with thevacuum chuck. The method further includes rotating, using the vacuumchuck, the process kit ring adaptor and the process kit ring to alignthe process kit ring. The method further includes lifting, using the endeffector, the process kit ring adaptor and process kit ring from thevacuum chuck for process kit ring replacement in a process chamber ofthe processing system.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings in which likereferences indicate similar elements. It should be noted that differentreferences to “an” or “one” embodiment in this disclosure are notnecessarily to the same embodiment, and such references mean at leastone.

FIG. 1 illustrates a processing system, according to one aspect of thedisclosure.

FIG. 2A illustrates a side view of a process kit ring adaptor on an endeffector, according to certain embodiments.

FIG. 2B illustrates a cross-sectional view of a process kit ring on aprocess kit ring adaptor, according to certain embodiments.

FIG. 2C illustrates a side view of a process kit ring adaptor on an endeffector, according to certain embodiments.

FIG. 2D illustrates a cross-sectional view of a process kit ring on aprocess kit ring adaptor, according to certain embodiments.

FIG. 3A illustrates a cross-sectional view of a pin contact on a processkit ring adaptor, according to certain embodiments.

FIG. 3B illustrates a cross-sectional view of a process kit ring adaptorthat forms a recess, according to certain embodiments.

FIG. 3C illustrates a cross-sectional view of a process kit ring adaptorthat interfaces with an end effector, according to certain embodiments.

FIG. 3D illustrates a cross-sectional view of a process kit ring adaptorthat interfaces with an end effector, according to certain embodiments.

FIG. 3E illustrates a cross-sectional view of a process kit ring adaptorthat interfaces with a lift pin, according to certain embodiments.

FIG. 4A illustrates a perspective view of a process kit ring adaptor,according to certain embodiments.

FIG. 4B illustrates a top view of a process kit ring disposed on aprocess kit ring adaptor that is disposed on an end effector, accordingto certain embodiments.

FIG. 4C illustrates a top view of a process kit ring disposed on aprocess kit ring adaptor that is disposed on an end effector, accordingto certain embodiments.

FIG. 4D illustrates a bottom view of a process kit ring on a process kitring adaptor and a top view of an end effector, according to certainembodiments.

FIG. 5A illustrates a cross-sectional view of a process kit ringadaptor, according to certain embodiments.

FIG. 5B illustrates a top view of a process kit ring adaptor on an endeffector, according to certain embodiments.

FIG. 6A illustrates a perspective view of a process kit ring adaptor,according to certain embodiments.

FIG. 6B illustrates a top view of a process kit ring adaptor on an endeffector, according to certain embodiments.

FIG. 6C illustrates a top view of a process kit ring adaptor on an endeffector, according to certain embodiments.

FIG. 6D illustrates a top view of a process kit ring adaptor on an endeffector, according to certain embodiments.

FIG. 6E illustrates a top view of a process kit ring adaptor on an endeffector, according to certain embodiments.

FIG. 7A illustrates a side view of a process kit ring disposed on aprocess kit ring adaptor secured to a vacuum chuck, according to certainembodiments.

FIG. 7B illustrates a top view of a process kit ring disposed on aprocess kit ring adaptor secured to a vacuum chuck, according to certainembodiments.

FIG. 8A illustrates a cross-sectional view of a process kit ring adaptoron a fin of a support structure of a process kit enclosure system,according to certain embodiments.

FIG. 8B illustrates a cross-sectional view of a process kit ringdisposed on a process kit ring adaptor on a fin of a support structureof a process kit enclosure system, according to certain embodiments.

FIG. 8C illustrates a top view of retention devices securing a processkit ring disposed on a process kit ring adaptor on a fin of a supportstructure of a process kit enclosure system, according to certainembodiments.

FIG. 8D illustrates a cross sectional view of a process kit ring adaptoron a fin of a support structure of a process kit enclosure system,according to certain embodiments.

FIG. 8E illustrates a cross sectional view of a process kit ringdisposed on a process kit ring adaptor on a fin of a support structureof a process kit enclosure system, according to certain embodiments.

FIG. 8F illustrates a top view of retention devices securing a processkit ring disposed on a process kit ring adaptor on fins of supportstructures of a process kit enclosure system, according to certainembodiments.

FIGS. 8G-H illustrate cross sectional views of a process kit ringadaptor and a fin of a process kit enclosure system, according tocertain embodiments.

FIG. 9A-B illustrate methods for process kit ring replacement inprocessing chambers, according to certain embodiments.

DETAILED DESCRIPTION OF EMBODIMENTS

Embodiments described herein are related to a process kit ring adaptor.Process kit rings may surround substrates and/or portions of substratesupport assemblies in a processing chamber to protect components (e.g.,to protect the substrate support assembly) of the processing chamber. Asthe substrates are etched by etchant chemistry, the process kit ringsmay deteriorate over time. Deteriorated processing kit rings lead toprocessing non-uniformity (e.g., non-uniformity in processed substrates,non-uniformity in processes, etc.). To avoid non-uniformity, process kitrings are to be periodically replaced. Conventionally, to replace aprocess kit ring, the processing chamber is opened. After being opened,the processing chamber goes through a long requalification process. Therequalification process impacts line yield, scheduling, quality, usertime, energy used, and so forth.

The devices, systems, and methods disclosed herein use a process kitring adaptor to enable automated replacement of process kit rings (e.g.,without opening a process chamber). One or more lower surfaces of theprocess kit ring adaptor may interface with an end effector on a robotarm and one or more lower surfaces of the process kit ring adaptor mayinterface with a vacuum chuck. One or more upper surfaces of the processkit ring adaptor may support a process kit ring (or multiple differentprocess kit rings). In some embodiments, a process kit ring adaptor mayinclude a rigid carrier including an upper surface and a lower surface.The upper surface may include a first distal portion and a second distalportion to support a process kit ring. The lower surface may include afirst region to interface with an end effector configured to supportwafers and a solid planar central region to interface with a vacuumchuck. In some embodiments, the process kit ring adaptor may include afirst reinforcement structure and a vacuum interface structure coupledto a lower surface of the first reinforcement structure. The firstreinforcement structure may include a first distal end and a seconddistal end for supporting a process kit ring. The vacuum interfacestructure may from a solid planar lower surface to interface with avacuum chuck. In some embodiments, the solid planar central region isomitted and the process kit ring adaptor is not chucked using a vacuumchuck.

The devices, systems, and methods disclosed herein have advantages overconventional solutions. The process kit ring adaptor may enableautomated replacement of process kit rings in a wafer processing systemwithout opening of a process chamber and without a subsequentrequalification process. The process kit ring adaptor may interface withequipment used for transfer of wafers (e.g., end effector on a robotarm, vacuum chuck, lift pins, etc.). Use of the process kit ring adaptorenables wafer handling components (e.g., vacuum chucks, end effectors,robot arms, slit valves, load ports, etc.) of a wafer processing systemto also handle process kit rings without adaptation or with minimaladaptation. Use of the process kit ring adaptor to replace process kitrings has less impact on line yield, scheduling, substrate quality, usertime, energy used, and so forth than conventional solutions.

FIG. 1 illustrates a processing system 100 (e.g., a wafer processingsystem), according to one aspect of the disclosure. The processingsystem 100 includes a factory interface 101 that includes multiple loadports 128 to which cassettes 102 (e.g., FOUPs) may be coupled fortransferring wafers and/or other substrates into and out of theprocessing system 100. The factory interface 101 may also include aprocess kit enclosure system 130 (e.g., cassette, FOUP, etc.) coupled toa load port 128 for transferring content 110, such as process kit ringsinto and out of the processing system 100.

A load port 128 may include a front interface that forms a verticalopening. The load port 128 may also have a horizontal surface. Acassette 102 (e.g., FOUP) may have a front interface that forms avertical opening. The front interface of the cassette 102 may be sizedto interface with the front interface of the load port 128 (e.g., thevertical opening of the cassette 102 may be approximately the same sizeas the vertical opening of the load port 128). The cassette 102 may beplaced on the horizontal surface of the load port 128 and the verticalopening of the FOUP may align with the vertical opening of the load port128. The front interface of the cassette 102 may interconnect with(e.g., clamp to, be secured to, be sealed to) the front interface of theload port 128. A bottom plate (e.g., base plate) of the cassette 102 mayhave features (e.g., load features, such as recesses, that engage withload port kinematic pin features, a load port datum pin clearance,and/or a cassette 102 docking tray latch clamping feature) that engagewith the horizontal surface of the load port 128. The process kitenclosure system 130 may have features similar to those of cassette 102to interface with the load port 128 in a similar manner. The process kitenclosure system 130 may have a front interface that is also sized tointerface with the front interface of the load port. The process kitenclosure system 130 may be placed on the horizontal surface of the loadport 128 and the vertical opening of the process kit enclosure system130 may align with the vertical opening of the load port 128. The frontinterface of the process kit enclosure system 130 may interconnect withthe front interface of the load port 128. The process kit enclosuresystem 130 may also have a base plate that has features to engage withthe horizontal surface of the load port. The process kit enclosuresystem 130 may interface with the same load ports that are used forFOUPs and cassettes that contain wafers.

The process kit enclosure system 130 may include one or more items ofcontent 110, such as a process kit ring adaptor, a process kit ringdisposed on a process kit ring adaptor, etc. For example, the processkit enclosure system 130 may be coupled to the factory interface 101(e.g., load port 128) to enable automated transfer of a process kit ringon a process kit ring carrier into the processing system 100 forreplacement of a used process kit ring.

The processing system 100 also includes first vacuum ports 103 a, 103 bcoupling the factory interface 101 to respective degassing chambers 104a, 104 b. Second vacuum ports 105 a, 105 b may be coupled to respectivedegassing chambers 104 a, 104 b and disposed between the degassingchambers 104 a, 104 b and a transfer chamber 106 to facilitate transferof wafers and content 110 (e.g., process kit rings) into the transferchamber 106. In some embodiments, a processing system 100 includesand/or uses one or more degassing chambers 104 and a correspondingnumber of vacuum ports 103, 105 (e.g., a processing system 100 mayinclude a single degassing chamber 104, a single first vacuum port 103,and a single second vacuum port 105). The transfer chamber 106 includesa plurality of processing chambers 107 (e.g., four processing chambers107, size processing chambers, etc.) disposed therearound and coupledthereto. The processing chambers 107 are coupled to the transfer chamber106 through respective ports 108, such as slit valves or the like. Insome embodiments, the factory interface 101 is at a higher pressure(e.g., atmospheric pressure) and the transfer chamber 106 is at a lowerpressure. Each degassing chamber 104 (e.g., load lock, pressure chamber)may have a first door (e.g., first vacuum port 103) to seal thedegassing chamber 104 from the factory interface 101 and a second door(e.g., second vacuum port 105) to seal the degassing chamber 104 fromthe transfer chamber 106. Content may be transferred from the factoryinterface 101 into a degassing chamber 104 while the first door is openand the second door is closed, the first door may close, the pressure inthe degassing chamber 104 may reduce to match the transfer chamber 106,the second door may open, and the content may be transferred out of thedegassing chamber 104. A local center finding (LCF) device may be usedto align the content in the transfer chamber 106 (e.g., before enteringa processing chamber 107, after leaving the processing chamber 107). Forexample, a LCF device may determine a position of content (e.g., aprocess kit ring adaptor and/or process kit ring) with respect to theend effector of the robot arm (e.g., determine location with respect toan alignment point or centerline of the end effector). The LCF devicemay perform laser center finding LCF beam trajectories to perform LCFedge capture for x-y alignment of the process kit ring adaptor and/orthe process kit ring. In some embodiments, the LCF device is an alignerdevice.

The processing chambers 107 may include one or more of etch chambers,deposition chambers (including atomic layer deposition, chemical vapordeposition, physical vapor deposition, or plasma enhanced versionsthereof), anneal chambers, and the like. Some of the processing chambers107, such as etch chambers, may include process kit rings (e.g., edgering, processing ring, support ring, sliding ring, quartz ring, etc.)therein, which occasionally are to be replaced. While conventionalsystems are associated with disassembly of a processing chamber by anoperator to replace a process kit ring, the processing system 100 isconfigured to facilitate replacement of process kit rings withoutdisassembly of a processing chamber 107 by an operator.

Factory interface 101 includes a factory interface robot 111. Factoryinterface robot 111 may include a robot arm (e.g., including an endeffector), and may be or include a selective compliance assembly robotarm (SCARA) robot, such as a 2 link SCARA robot, a 3 link SCARA robot, a4 link SCARA robot, and so on. The factory interface robot 111 mayinclude an end effector on an end of the robot arm. The end effector maybe configured to pick up and handle specific objects, such as wafers.Alternatively, the end effector may be configured to handle objects suchas a process kit ring (edge rings) disposed on a process kit ringadaptor. The factory interface robot 111 may be configured to transferobjects between cassettes 102 (e.g., FOUPs) and degassing chambers 104a, 104 b.

Transfer chamber 106 includes a transfer chamber robot 112. Transferchamber robot 112 may include a robot arm with an end effector at an endof the robot arm. The end effector may be configured to handleparticular objects, such as wafers. The transfer chamber robot 112 maybe a SCARA robot, but may have fewer links and/or fewer degrees offreedom than the factory interface robot 111 in some embodiments. Theend effector of the transfer chamber robot 112 may additionally beconfigured to handle specific objects, such as wafers.

A controller 109 controls various aspects of the processing system 100.The controller 109 may be and/or include a computing device such as apersonal computer, a server computer, a programmable logic controller(PLC), a microcontroller, and so on. The controller 109 may include oneor more processing devices, which may be general-purpose processingdevices such as a microprocessor, central processing unit, or the like.More particularly, the processing device may be a complex instructionset computing (CISC) microprocessor, reduced instruction set computing(RISC) microprocessor, very long instruction word (VLIW) microprocessor,or a processor implementing other instruction sets or processorsimplementing a combination of instruction sets. The processing devicemay also be one or more special-purpose processing devices such as anapplication specific integrated circuit (ASIC), a field programmablegate array (FPGA), a digital signal processor (DSP), network processor,or the like. The controller 109 may include a data storage device (e.g.,one or more disk drives and/or solid state drives), a main memory, astatic memory, a network interface, and/or other components. Thecontroller 109 may execute instructions to perform any one or more ofthe methods or processes described herein. The instructions may bestored on a computer readable storage medium, which may include the mainmemory, static memory, secondary storage and/or processing device(during execution of the instructions). The controller 109 may receivesignals from and send controls to factory interface robot 111 and wafertransfer chamber robot 112 in embodiments.

FIG. 1 schematically illustrates transfer of content 110 (e.g., aprocess kit ring coupled to a process kit ring adaptor) into aprocessing chamber 107. According to one aspect of the disclosure,content 110 is removed from a process kit enclosure system 130 viafactory interface robot 111 located in the factory interface 101. Thefactory interface robot 111 transfers the content 110 through one of thefirst vacuum ports 103 a, 103 b and into a respective degassing chamber104 a, 104 b. A transfer chamber robot 112 located in the transferchamber 106 removes the content 110 from one of the degassing chambers104 a, 104 b through a second vacuum port 105 a or 105 b. The transferchamber robot 112 moves the content 110 into the transfer chamber 106,where the content 110 may be transferred to a processing chamber 107though a respective port 108. While not shown for clarity in FIG. 1,transfer of the content 110 may include transfer of a process kit ringdisposed on a process kit ring adaptor, transfer of an empty process kitring adaptor, transfer of a placement validation wafer, etc.

FIG. 1 illustrates one example of transfer of content 110, however,other examples are also contemplated. For example, it is contemplatedthat the process kit enclosure system 130 may be coupled to the transferchamber 106 (e.g., via a load port in the transfer chamber 106). Fromthe transfer chamber 106, the content 110 may be loaded into aprocessing chamber 107 by the transfer chamber robot 112. Additionally,content 110 may be loaded in a substrate support pedestal (SSP). Anadditional SSP may be positioned in communication with the factoryinterface 101 opposite the illustrated SSP. It is contemplated that aprocessed content 110 (e.g., used process kit ring) may be removed fromthe processing system 100 in reverse of any manner described herein.When utilizing multiple process kit enclosure systems 130 or acombination of process kit enclosure system 130 and SSP, it iscontemplated that one SSP or process kit enclosure system 130 may beused for unprocessed content 110 (e.g., new process kit rings), whileanother SSP or process kit enclosure system 130 may be used forreceiving processed content 110 (e.g., used process kit rings).

In some embodiments, a process kit ring that is secured to an uppersurface of a process kit ring adaptor may be stored in the process kitenclosure system 130 and a factory interface robot 111 may insert an endeffector of the factory interface robot 111 into the process kitenclosure system 130 below the process kit ring adaptor, lift theprocess kit ring adaptor, and extract the process kit ring adaptor fromthe process kit enclosure system 130 to transport the process kit ringsecured to the process kit ring adaptor on the robot within theprocessing system 100. In some embodiments, a process kit ring is storedwithin the process kit enclosure system 130 (e.g., without being securedto a process kit ring adaptor). Factory interface robot 111 may obtainan empty process kit ring adaptor from within the processing system 100or the process kit enclosure system 130 and may use the empty processkit ring adaptor to remove the process kit ring from the process kitenclosure system 130 to transport the process kit ring secured to theprocess kit ring adaptor within the processing system 100.

In some embodiments, an empty process kit ring adaptor is stored in theprocess kit enclosure system 130. Factory interface robot 111 mayretrieve the empty process kit ring adaptor, which may then betransferred to degassing chamber 104 a, 104 b, to transfer chamber robot112, and into a process chamber 107. A used process kit ring may then beplaced on the process kit ring adaptor, and the process kit ring plusthe process kit ring adaptor may then be transferred to degassingchamber 104 a, 104 b, back to factory interface robot 111, and into theprocess kit enclosure system 130.

FIGS. 2A-D illustrate views of process kit ring adaptors 200 on an endeffector 212 of a robot arm 210 for transfer of a process kit ring 220,according to certain embodiments. Although a single process kit ring 220is illustrated in FIGS. 2B and 2D, one or more process kit rings 220 maybe disposed on each process kit ring adaptor 200. For example, two orthree process kit rings 220 may be nested within each other (e.g., afirst process kit ring of a first diameter, a second process kit ring ofa second diameter sized to fit within the first process kit ring, and athird process kit ring of a third diameter sized to fit within thesecond process kit ring) on the process kit ring adaptor 200. Automationelements, such as a robot arm 210, may be used for automated transfer(e.g., insertion to and removal from) of a process kit ring 220 betweena process chamber of a wafer processing system and a process kitenclosure system (e.g., FOUP). The process kit ring adaptor 200 may be amechanical intermediate adaptor (e.g., carrier) allowing the process kitring 220 to be held, maneuvered, and removed from the processing chamberusing existing automation elements (e.g., end effector 212 of robot arm,wafer pins, elements designed for wafer handling, etc.). The process kitring adaptor 200 may be provided between the end effector 212 and theprocess kit ring 220. The process kit ring 220 may be constrained inx-translation, y-translation, and z-rotation by features (e.g., one ormore pin contacts 202, one or more recesses 204, etc.) of the processkit ring adaptor 200. The process kit ring 220 may be constrained inz-translation, x-rotation, and y-rotation by gravity. Features (e.g.,extrusions, inserts, etc.) may be disposed on the lower surface of theprocess kit ring 220 to maintain the lower surface elevated above theportion of the end effector 212 below the process kit ring adaptor 200.

FIG. 2A illustrates a side view of a process kit ring adaptor 200A on anend effector 212, according to certain embodiments. FIG. 2B illustratesa cross-sectional view of a process kit ring 220 on a process kit ringadaptor 200A, according to certain embodiments. The process kit ring 220may be disposed on the process kit ring adaptor 200A (e.g., anapproximately planar upper surface of the process kit ring adaptor 200A)in a stacked configuration. The process kit ring adaptor 220A may haveone or more pin contacts 202 (e.g., extrusions, protrusions, inserts,etc.) on an upper surface of the process kit ring adaptor 220A (e.g.,disposed on, inserted into the upper surface, etc.). The one or more pincontacts 202 may be proximate a portion of the upper surface proximatethe perimeter that is to support the process kit ring 220. A sidewall ofthe one or more pin contacts 202 may be in contact with the process kitring 220 responsive to the process kit ring 220 being disposed on theprocess kit ring adaptor 200A. The one or more pin contacts 202 may beused to prevent movement (e.g., horizontal movement) of the process kitring 220 on the process kit ring adaptor 200A (e.g., constrain theprocess kit ring 220 in x-translation, y-translation, and z-rotation oryaw rotation).

In some embodiments, two or more pin contacts 202 located substantiallyopposite to each other are located on the upper surface of the processkit ring adaptor 200A and are used to prevent translational and/orrotational movement of the process kit ring 220.

FIG. 2C illustrates a side view of a process kit ring adaptor 200B on anend effector 212, according to certain embodiments.

FIG. 2D illustrates a cross-sectional view of a process kit ring 220 ona process kit ring adaptor 200B, according to certain embodiments. Theprocess kit ring 220 may be disposed on the process kit ring adaptor200B in an embedded configuration (e.g., in the recesses 204). Theprocess kit ring adaptor 220B may have one or more recesses 204 (e.g.,extrusions, inserts, etc.) on an upper surface of the process kit ringadaptor 220B. The one or more recesses 204 may be proximate a portion ofthe upper surface proximate the perimeter that is to support the processkit ring 220. The one or more recesses 204 may be sized and shaped toreceive the process kit ring 220. A substantially horizontal surfaceand/or a substantially vertical surface of the one or more recesses 204may be in contact with the process kit ring 220 responsive to theprocess kit ring 220 being disposed on the process kit ring adaptor200B. The one or more recesses 204 may be used to prevent movement(e.g., horizontal movement) of the process kit ring 220 on the processkit ring adaptor 200B (e.g., constrain the process kit ring 220 inx-translation, y-translation, and z-rotation).

In some embodiments, two or more recesses 204 are located substantiallyopposite to each other (e.g., proximate curved portions of the perimeterof the process kit ring adaptor 200B) and are used to prevent movementof the process kit ring 220.

FIG. 3A illustrates a cross-sectional view of a pin contact 302 (e.g.,pin contact 202 of FIGS. 2A-B) on a process kit ring adaptor 300A (e.g.,process kit ring adaptor 200A of FIGS. 2A-B), according to certainembodiments. In some embodiments, the pin contact 302 may be apolyethylene terephthalate (PET) insert. In some embodiments, there arethree pin contacts 302. The sidewall of the pin contact 302 may besloped (e.g., narrower further away from the process kit ring adaptor300A and wider closer to the process kit ring adaptor 300A, a slopedsidewall). A portion of the sidewall proximate the top of the pincontact 302 may be curved (e.g., tapered). A draft angle of the slopedsidewall may allow for the process kit ring 320 to have error upon beinglowered onto the process kit ring adaptor 300A and may guide the processkit ring 320 into place (e.g., to a target position at the first distalportion of the upper surface of the carrier). The sidewall of the pincontact 302 may have a first coefficient of friction (e.g., lowcoefficient of friction) to allow sliding on entry. A substantiallyhorizontal surface of the pin contact 302 on which the process kit ring320 is disposed (e.g., proximate the sidewalls of the pin contact 302)may have a second coefficient of friction (e.g., a high coefficient offriction, a coefficient of friction that is higher than the firstcoefficient of friction of the sidewalls) to prevent sliding andshifting (e.g., to prevent horizontal movement) of the process kit ring320 during automated transfers (e.g., on the end effector of the robotarm) and during transportation of the process kit enclosure system(e.g., FOUP).

FIG. 3B illustrates a cross-sectional view of a process kit ring adaptor300B that forms a recess 304 (e.g., notch), according to certainembodiments. The recess 304 may have a substantially horizontal surfaceto support the bottom surface of the process kit ring 320. The recess304 may have a sloped sidewall (e.g., have a draft angle, a guide taper)to allow for the process kit ring 320 to have error upon being loweredonto the process kit ring adaptor 300B and may guide the process kitring 320 into place.

FIG. 3C illustrates a cross-sectional view of a process kit ring adaptor330C that interfaces with an end effector, according to certainembodiments. The end effector 212 may form one or more recesses and alower surface of the process kit ring adaptor 330C may form one or morefeatures (e.g., extrusions, etc.) that are sized and shaped (e.g., coneshape, dowel shape, etc.) to interface with the end effector 312 (e.g.,to prevent movement of the process kit ring adaptor 300C on the endeffector 312). The sidewall of the feature or the sidewall of the recessmay be sloped (e.g., a guide taper) to allow for alignment error (e.g.,upon lowering the process kit ring adaptor 300C onto the end effector312 or lifting the end effector 312 to raise the process kit ringadaptor 300C).

In addition to or as an alternative to a recess in the end effector 312,a feature (e.g., extrusion, pin contact, etc.) may be disposed on theend effector (e.g., on the horizontal surface of the recess, on theupper surface of the end effector) that aligns with a recess in thelower surface of the process kit ring adaptor 300C.

FIG. 3D illustrates a cross-sectional view of a process kit ring adaptor300D that interfaces with an end effector 312, according to certainembodiments. One or more mechanical safety guides 306 (e.g., protrusion,pin contact, etc.) may be disposed on a lower surface of the process kitring adaptor 300D. A mechanical safety guide 306 may interface with arecess 316 formed by an upper surface of the end effector 312. Themechanical safety guide 306 interfacing with a recess 316 may allow foralignment error (e.g., upon lowering the process kit ring adaptor 300Conto the end effector 312 or lifting the end effector 312 to raise theprocess kit ring adaptor 300C). The mechanical safety guide 306interfacing with a recess 316 may prevent movement of the process kitring adaptor 300D (e.g., not slip off end effector 312 despite vibrationof the end effector 312).

FIG. 3E illustrates a cross-sectional view of a process kit ring adaptor300E (e.g., lift pin interface) that interfaces with a lift pin 318(e.g., carrier lift pin, wafer lift pin), according to certainembodiments. The lift pin 318 may be a wafer lift pin (e.g., used forlifting wafers in process chambers). A receptacle 319 may be formed in alower surface of the process kit ring adaptor 300E to receive the liftpin 318. The receptacle 319 includes a body 330 having a cylindricalshape and a flared base 331 at one end of the body 330. In someembodiments, the body 330 is disposed through the process kit ringadaptor 300E and in some embodiments, the body is embedded in the lowersurface of the process kit ring adaptor 300E (e.g., does not extendthrough). The flared base 331 may be partially positioned in and contacta counterbore formed on a lower surface of the process kit ring adaptor300E. The receptacle 319 may include a first recess 332 extending intothe body 330 and a counterbore 333 formed in the flare base 331. Therecess 332 and the counterbore 333 may be coupled by a tapering sidewall334 to facilitate feature engagement (e.g., engagement with lift pin318). In one example, the recess 222 has an oblong or parabolic shape toaccommodate a diametrical alignment feature. In such an example, therecess 332 may have a greater width in a direction parallel to the twosubstantially parallel edges of the perimeter of the process kit ringadaptor 300E (as opposed to a direction perpendicular to the twosubstantially parallel edges). The parabolic or oblong shape of therecess 332 may facilitate accommodation of the lift pin 318 within therecess 332.

FIG. 4A illustrates a perspective view of an upper surface of a processkit ring adaptor 400 (e.g., one or more of process kit ring adaptor 200Aof FIGS. 2A-B, process kit ring adaptor 300A of FIG. 3A, etc.),according to certain embodiments. The process kit ring adaptor 400 mayhave a rigid carrier (e.g., plate) made out of carbon fiber. Theperimeter of the process kit ring adaptor may include first and secondcurved portions 492A-B and first and second flat portions 494A-B. Thefirst and second flat portions 494A-B may be sized and shaped to avoidinterference with process kit ring lift pins.

The process kit ring adaptor 400 may have one or more pin contacts 402for preventing movement of a process kit ring 420 disposed on theprocess kit ring adaptor 400. In some embodiments, the pin contacts 402are made of polyethylene terephthalate (PET). In some embodiments, thepin contacts 402 are used for supporting the process kit ring andcentering the process kit ring on the process kit ring adaptor 400.

A central region 440 of the process kit ring adaptor 400 may be solid(e.g., planar, smooth, not perforated, etc.) to be compatible with avacuum chuck of an aligner or other station. The lower surface of thecentral region may interface (e.g., via a vacuum interface, seal to,etc.) with the vacuum chuck for rotation and alignment of the processkit ring adaptor 400 and/or a process kit ring.

One or more friction pads 442 may be disposed on the process kit ringadaptor 400 to interface with one or more of a top surface of the vacuumchuck or a top surface of the end effector of a robot arm. In someembodiments, the friction pads 442 are embedded in or disposed on thelower surface of the process kit ring adaptor 400 to provide frictionbetween the lower surface of the process kit ring adaptor 400 and thetop surface of the vacuum chuck and/or the top surface of the endeffector. In some embodiments, the friction pads 442 pass through theprocess kit ring adaptor 400 to provide friction between the lowersurface of the process kit ring adaptor 400 and the top surface of thevacuum chuck and/or the top surface of the end effector. The one or morefriction pads 442 may provide clearance to avoid interference withfeatures (e.g., blade fang, wafer contract pads, plunger, and wrist) ofthe end effector 412. The friction pads 442 may be a polymer (e.g.,viscous fluorinated polymer) and may be resistant to corrosivematerials.

One or more kinematic inserts 446 (e.g., body 330 forming receptacle 319of FIG. 3E) may be made of PET and may be used for theta alignment onlift pins (e.g., lift pin 318 of FIG. 3E). The kinematic inserts 446 maypass through the process kit ring adaptor 400 or may be disposed on orembedded in the lower surface of the process kit ring adaptor 400.

A flat insert 448 may be made of PET and may be used to align thetaangle of process kit rings (e.g., theta angle alignment feature). Theflat insert 448 may interface with a flat portion of the inner sidewallof a process kit ring. The flat insert 448 may be used by the alignerfor alignment of the process kit ring adaptor 400 and/or a process kitring.

The process kit ring adaptor 400 may form one or more plate openings 450to reduce weight of the process kit ring adaptor 400.

FIG. 4B illustrates a top view of a process kit ring 420 disposed on aprocess kit ring adaptor 400 that is disposed on a first end effector412A, according to certain embodiments. FIG. 4C illustrates a top viewof a process kit ring 420 disposed on a process kit ring adaptor 400that is disposed on a second end effector 412, according to certainembodiments. The process kit ring adaptor 400 may have first features(e.g., friction pads 442) that align with end effectors 412 of differentsizes and from different orientations. The process kit ring adaptor 400may have second features (e.g., kinematic insert 446) that are notblocked by one or more end effectors 412 from one or more orientations(e.g., for receiving lift pins to lift the process kit ring adaptor 400and process kit ring 420 off of the end effector 412). In someembodiments, instead of a flat insert 448, the process kit ring adaptor400 may form a slot 452 to be used by the aligner for alignment of theprocess kit ring adaptor 400 and/or a process kit ring 420. A differentpin contact 480A, 480B may be disposed on either side of the slot 452.The pin contacts 480A, 480B may be used to align a flat interiorsidewall surface or other registration feature of the process kit ring420 to the process kit ring adaptor 400. In some embodiments, the slot452 may have a length that corresponds to the length of the flat orother registration feature of the process kit ring 420 (e.g., the slotmay extend to the surfaces where the pin contacts 480A, 480B are shownin FIGS. 4B-4C, the process kit ring adaptor 400 may not have pincontacts 480A, 480B). In some embodiments, the process kit ringenclosure system has one or more features (e.g., pin contacts) that fitwithin the slot 452 to engage with the flat or other registrationfeature of the process kit ring 420 to limit movement. The one or morefeatures of the process kit ring enclosure system may be sized andlocated relative to the process kit ring 420 similar to how pin contacts480A, 480B are sized and located relative to the process kit ring 420 inFIGS. 4B-4C. The slot 452 may be sized for an aligner device to locatethe process kit ring 420 and/or the process kit ring adaptor 400 usingthe slot 452 (e.g., capture an image via the slot 452, determine adistance via the slot 452).

The process kit ring adaptor 400 may be sized and shaped to provide oneor more gaps between the process kit ring 420 and one or more curvedportions of the perimeter of the process kit ring adaptor 400. The oneor more gaps may be used by the aligner device for alignment of theprocess kit ring adaptor 400 and/or a process kit ring 420. Inparticular, the one or more gaps (e.g., the slot 425) may enable a lightbeam to be used to detect the flat or other registration feature in theprocess kit ring 420.

The end effectors 412 may not cover the lower surface of the centralregion 440 (e.g., a vacuum chuck may interface with the central region440 of the process kit ring adaptor 400 while the process kit ringadaptor 400 is on or above the end effector 412).

FIG. 4D illustrates a bottom view of a process kit ring 420 on a processkit ring adaptor 400 and a top view of an end effector 412A, accordingto certain embodiments. Mechanical safety guides 406 (e.g., mechanicalsafety guides 306 of FIG. 3D) may be coupled to a lower surface of theprocess kit ring adaptor 400. An upper surface of end effector 412 mayform recesses 416 (e.g., recess 316 of FIG. 3D). The mechanical safetyguides 406 may be sized, shaped, and located to interconnect with (e.g.,fit within) the recesses 416. In some embodiments, the end effector 412Ahas recesses 416 that interconnect with extrusions (e.g., mechanicalsafety guides 406, feet) of the process kit ring adaptor 400. In someembodiments, the end effector 412A has extrusions (e.g., pads, feet)that interconnect with recesses in the process kit ring adaptor 400. Thelower surface of the process kit ring adaptor 400 may include frictionpads 442 that interface with the upper surface of the end effector 412responsive to the mechanical safety guides 406 interconnecting with therecesses 416. The friction pads 442 may prevent movement of the processkit ring adaptor 400 in relation to the end effector 412A. The frictionpads 442 may keep the lower surface of the process kit ring adaptor 400a threshold distance from the upper surface of the end effector 412A(e.g., to prevent the process kit ring adaptor 400 from touching raisedportions of the end effector 412A or robot arm). The lower surface ofthe process kit ring adaptor may have kinematic inserts 446 (e.g.,receptacle 319 of FIG. 3E) that are not above the end effector 412responsive to the mechanical safety guides 406 interconnecting with therecesses 416. The kinematic inserts 446 may be sized, shaped, andlocated to engage with lift pins (e.g., carrier lift pins, wafer liftpins, etc. The pin contacts 402 may pass through the process kit ringadaptor 400 or may be disposed on (e.g., embedded in) the upper surfaceof the process kit ring adaptor 400.

FIG. 5A illustrates a cross-sectional view of a process kit ring adaptor500, according to certain embodiments. FIG. 5B illustrates a top view ofa process kit ring adaptor 500 on an end effector 512, according tocertain embodiments. The process kit ring adaptor 500 may include aplate 560 and one or more reinforcement structures 562 (e.g., a firstreinforcement structure 562A and a second reinforcement structure 562B).The process kit ring adaptor 500 including a plate 560 and one or morereinforcement structures 562 may have a larger vertical cross sectionthan a process kit ring adaptor without reinforcement structures 562.The larger vertical cross section may provide increased vertical supportand may reduce weight while maintaining same strength. Due to the one ormore reinforcement structures 562, the plate 560 may be thinner than aprocess kit ring adaptor without reinforcement structures 562. Distalends of the one or more reinforcement structures 562 may form a recess(e.g., have a hook that forms a recess) to hold the process kit ring 520(e.g., see recess 304 of FIG. 3B). The torsional rigidity of the processkit ring adaptor 500 may be reinforced by the plate 560 (e.g., a plate560 made of carbon fiber sheet). The one or more reinforcementstructures 562 may be made by a single machining operation to provideprecise positional tolerance.

Distal ends 514 of the end effector 512 may grip the edge of the plate560 of the process kit ring adaptor 500. A movement device 516 may pushagainst the process kit ring 520 which pushes against the process kitring 520 to engage the plate 560 with the distal ends 514 (e.g., toprovide gripping of the plate 560 by the distal ends 514).

Reinforcement structure 562 may have a square or rectangularcross-section. The cross-section of each of the reinforcement structures562 may be the same or substantially similar. The reinforcementstructures 562 may include reinforcement structure 562A andreinforcement structure 562B that intersect at middle portions of thereinforcement structures 562A-B.

FIG. 6A illustrates a perspective view of a process kit ring adaptor600, according to certain embodiments. FIGS. 6B-E illustrate top viewsof a process kit ring adaptors 600 on an end effector 612, according tocertain embodiments.

Process kit ring adaptor 600 may include a vacuum interface structure660 (e.g., a plate 560 that is sized to interface with the vacuum chuck,a plate 560 without any features). The process kit ring adaptor 600 mayinclude a reinforcement structure 662 that has a lower surface that iscoupled to an upper surface of the vacuum interface structure 660. Thereinforcement structure 662 may include distal ends 664 that formrecesses 604 for supporting the process kit ring 620. The reinforcementstructure 662 may include features 674 (e.g., insert structures such asmechanical safety guide 306 of FIG. 3D, receptacle 319 of FIG. 3E,friction pads 442 and kinematic inserts 446 of FIG. 4A, etc.). Thereinforcement structure 662 may include a first structural component670A that extends from a first distal end 664A that forms a first recess604A to a second distal end 664B that forms a second recess 604B, wherethe process kit ring 620 is disposed in the recesses 604A-B. Thereinforcement structure 662 may include a second structural component670B that extends from a third distal end 664C that forms a third recess604C to a fourth distal end 664D that forms a fourth recess 604D, wherethe process kit ring 620 is disposed in the recesses 604A-D.

The reinforcement structure 662 may include additional structuralcomponents 672.

One or more of the additional structural components 672 may extend fromone or both of the first and second structural components 670A-B to thefeatures 674 (e.g., mechanical safety guide 306 of FIG. 3D, receptacle319 of FIG. 3E, friction pads 442 and kinematic inserts 446 of FIG. 4A,etc.). One or more of the additional structural components may be usedas an alignment feature or for balancing the rest of the reinforcementstructure 662.

The first and second structural components 670A-B may each have a firstcross section and the additional structural components 672 may each havea second cross section. The first cross section and the second crosssection may be square or rectangular. The first cross section may begreater than the second cross section. The process kit ring adaptor 600may avoid process kit ring lift pins. The process kit ring adaptor 600may be lighter weight and use less material than a process kit ringadaptor that does not have a reinforcement structure.

In some embodiments, the process kit ring 620 may be disposed directlyon the process kit ring adaptor 600 (e.g., see FIG. 6C). In someembodiments, a support structure 676 may be disposed on the distal ends664 of the reinforcement structure 662 of the process kit ring adaptor600 (e.g., see FIG. 6D). The support structure may form a circularinside perimeter and an outside perimeter that includes a first curvededge, a second curved edge opposite the first curved edge, a firstparallel edge and a second parallel edge that is substantially parallelto the first parallel edge. The parallel edges may be used to enternarrow openings (e.g., narrow load lock openings) and exit narrowopenings (e.g., clearance to retract the process kit ring adaptor 600from the processing chamber after lifting the process kit ring 620 offof the process kit ring adaptor 600). The process kit ring 620 may bedisposed on the support structure 676 (e.g., see FIG. 6E).

FIG. 7A illustrates a side view of a process kit ring 720 disposed on aprocess kit ring adaptor 700 secured to a vacuum chuck 790 of an alignerdevice 792, according to certain embodiments. FIG. 7B illustrates a topview of a process kit ring 720 disposed on a process kit ring adaptor700 secured to a vacuum chuck 790 of an aligner device 792, according tocertain embodiments. The end effector of the robot arm may place theprocess kit ring 720 disposed on the process kit ring adaptor 700 on thevacuum chuck 790. The vacuum chuck 790 may interface with the lowersurface of the central region of the process kit ring adaptor 700. Theprocess kit ring adaptor 700 may have one or more features (e.g.,friction pads 442, etc.) to interface with the aligner device 792.

The vacuum chuck 790 may spin the process kit ring adaptor 700 andprocess kit ring 720 while scanning the process kit ring 720 for a flatinner wall 722 of the process kit ring 720 (e.g., flat angle) and whileperforming metrology inspection. The flat inner wall 722 may be afiducial to provide camera-machine vision alignment. A portion of theperimeter of the process kit ring adaptor 700 may be flat to interfacewith the flat inner wall 722 of the process kit ring 720. The gapsbetween the process kit ring adaptor 700 and the process kit ring 720may provide through beam clearance to detect the inside edge of theprocess kit ring 720.

FIGS. 8A-F illustrate a process kit ring adaptor 800 disposed on one ormore fins 894 of a process kit enclosure system 830, according tocertain embodiments. In some embodiments, the process kit ring adaptor800 has a planar bottom surface on a first plane and has one or morefeatures (e.g., extrusions, pads) that extend from the first plane. Forexample, the process kit ring adaptor 800 may have one or more pads thatwrap from a side surface of the process kit ring adaptor 800 to a bottomsurface of the process kit ring adaptor 800. Each fin 894 may have arecess (e.g., slot) to receive the feature (e.g., pad) of the processkit ring adaptor 800. In some embodiments, only the features of theprocess kit ring adaptor 800 engage with the fin (e.g., the planarbottom surface of the process kit ring adaptor 800 does not engage withthe fins 894). In some embodiments, the recesses of the fins 894 (thatreceive the pads of the process kit ring adaptor 800) constrain movementof the process kit ring adaptor 800 in the x-direction and they-direction.

FIG. 8A illustrates a cross-sectional view of a process kit ring adaptor800 on a fin 894A of a process kit enclosure system 830, according tocertain embodiments. FIG. 8B illustrates a cross-sectional view of aprocess kit ring 820 disposed on a process kit ring adaptor 800 on a fin894A of a process kit enclosure system 830, according to certainembodiments. FIG. 8C illustrates a top view of retention devices 896securing a process kit ring 820 disposed on a process kit ring adaptor800 on a fin 894A of a process kit enclosure system 830, according tocertain embodiments. The process kit ring adaptor 800 may be disposed onone or more fins 894 (e.g., two fins, three fins, four fins, etc.).

The fin 894A may form a recess to secure the process kit ring adaptor800. The recess may be shaped to align, locate and capture the stack ofthe process kit ring on the process kit ring adaptor. The process kitring adaptor 800 may have a pin contact to secure the process kit ring820. In some embodiments, retention devices 896 may rotate to a securedposition to retain the process kit ring 820 on the process kit ringadaptor 800 during transportation of the process kit enclosure system830. In some embodiments, retention devices 896 may be placed in anunsecured position (e.g., rotated, rotated and removed, etc.) totransfer a process kit ring adaptor 800 and/or a process kit ring 820 ona process kit ring adaptor 800 into a processing system. In someembodiments, a retention device may pivot to secure the process kit ringadaptor 800 and/or process kit ring 820 responsive to a portion of theprocess kit ring adaptor 800 engaging with the retention device.

FIG. 8D illustrates a cross sectional view of a process kit ring adaptor800 on a fin 894B of a process kit enclosure system 830, according tocertain embodiments. FIG. 8E illustrates a cross sectional view of aprocess kit ring 820 disposed on a process kit ring adaptor 800 on a fin894B of a process kit enclosure system 830, according to certainembodiments. FIG. 8F illustrates a top view of retention devices 896securing a process kit ring 820 disposed on a process kit ring adaptor800 on fins 894A and 894B of a process kit enclosure system 830,according to certain embodiments. The process kit ring adaptor 800 maybe disposed on one or more fins 894A (e.g., one fin 894A, two fins 894A,three fins 894A, four fins 894A, etc.) and on one or more fins 894B(e.g., one fin 894B, two fins 894B, three fins 894B, four fins 894B,etc.).

The fin 894B may form a first recess to secure the process kit ringadaptor 800. The fin 894B may form a second recess to secure the processkit ring 820. Fin 894B may provide angular alignment (e.g., interfacingwith the flat inner wall 722 of process kit ring) and may provide aretaining feature.

Retention devices 896 may rotate to a secured position to retain theprocess kit ring 820 on the process kit ring adaptor 800 duringtransportation of the process kit enclosure system 830.

FIGS. 8G-H illustrate cross sectional views of a process kit ringadaptor 800 and a fin 894 of a process kit enclosure system 830,according to certain embodiments. In some embodiments, the retentiondevice 896 may be a pivoting clamp. When a processing kit adaptor 800 isnot on the fin 894, the center of gravity of the retention device 896may cause a clamp portion of the retention device 896 to be oriented toreceive a process kit ring adaptor 800 (e.g., as shown in FIG. 8G, theclamp portion of the retention device 896 may be oriented upward). Uponlowering the process kit ring adaptor 800 (e.g., with or without aprocess kit ring 820 on the process kit ring adaptor 800) onto the fin894, the process kit ring adaptor 800 may engage with the retentiondevice 896 (e.g., with the clamp portion of the retention device 896) tocause the retention device 896 to pivot to a secured position (e.g., afirst portion of the clamp portion of the retention device 896 above theprocess kit ring adaptor 800 and a second portion of the clamp portionof the retention device 896 below the process kit ring adaptor 800. Insome embodiments, the clamp portion of the retention device 896 may besized to receive one or more of the process kit ring adaptor 800 or theprocess kit ring 820 (e.g., the process kit ring 820 disposed on theprocess kit ring adaptor 800). The process kit ring adaptor 800 may havea one or more features (e.g., pad, foot, etc.), where a correspondingfeature engages with each fin 894 (e.g., a recess of each fin 894). Theone or more features may be the only portion of the process kit ringadaptor 800 that engage with the fins 894.

FIGS. 9A-9B illustrate methods 900A-B for process kit ring replacementin processing chambers, according to certain embodiments. Although shownin a particular sequence or order, unless otherwise specified, the orderof the processes can be modified. Thus, the illustrated embodimentsshould be understood only as examples, and the illustrated processes canbe performed in a different order, and some processes can be performedin parallel. Additionally, one or more processes can be omitted invarious embodiments. Thus, not all processes are required in everyembodiment. Other process flows are possible. In some embodiments,method 900B may follow method 900A.

Referring to FIG. 9A, at block 902, a first process kit ring adaptor(empty) is removed (e.g., by an end effector) from a process kitenclosure system (e.g., FOUP). The empty first process kit ring adaptormay be disposed in one of the lower slots in the process kit enclosuresystem. The first process kit ring adaptor may be disposed on fins(e.g., at two or more portions of the lower surface of the first processkit ring adaptor proximate the perimeter of the first process kit ringadaptor) within the process kit enclosure system. A corresponding uppersurface of a distal end of each fin may form a recess that is shaped andsized to receive a corresponding portion (e.g., a pad disposed on alower surface of the first process kit ring adaptor) proximate theperimeter of the first process kit ring adaptor. An end effector of arobot arm (e.g., factory interface robot) of a processing system mayenter the process kit enclosure system below the first process kit ringadaptor between the fins on which the first process kit ring adaptor issupported. The end effector may lift to interface the upper surface ofthe end effector with a lower surface of the first process kit ringadaptor. The upper surface of the end effector may form recesses thatinterconnect with features (e.g., mechanical safety guides, protrusions,pin contacts, etc.) of the lower surface of the first process kit ringadaptor. The lower surface of the first process kit ring adaptor mayhave friction pads that contact the upper surface of the end effector.The end effector may lift the first process kit ring adaptor.

A first upper surface of the end effector may interface with a lowersurface of the first process kit ring adaptor. The first process kitring adaptor may be disposed on fins of a process kit enclosure system(e.g., FOUP). The first process kit ring adaptor may be retained on thefins in the process kit enclosure system via a retaining feature. Theretaining feature may be placed in an unsecured position (e.g., rotated,removed, etc.) to remove the first process kit ring adaptor from theprocess kit enclosure system.

At block 904, the first process kit ring adaptor is transferred (e.g.,by the end effector) to an aligner device.

At block 906, the first process kit ring adaptor is placed (e.g., by theend effector) on a vacuum chuck of an aligner device. The friction padson the lower surface of the first process kit ring adaptor may interfacewith the aligner device. A planar central region (e.g., solid region) ofthe lower surface of the first process kit ring adaptor interfaces withthe vacuum chuck. The end effector may place the first process kit ringadaptor on the vacuum chuck by aligning the planar central region of thefirst process kit ring adaptor above the vacuum chuck and lowering theplanar central region of the first process kit ring adaptor on thevacuum chuck. The end effector may not cover the central region. The endeffector may remain lowered below the first process kit ring adaptor ormay be removed from below the first process kit ring adaptor.

At block 908, the first process kit ring adaptor is rotated by thevacuum chuck to align the first process kit ring adaptor. The alignerdevice may scan for one or more of: a slot of the first process kit ringadaptor; a protruding alignment feature of the first process kit ringadaptor; fiducials on the upper surface of the first process kit ringadaptor; etc.

The aligner device may scan the first process kit ring adaptor to locatea slot, registration feature, or fiducial of the first process kit ringadaptor. The first process kit ring adaptor may be shaped for a beam ofa ribbon sensor to detect the slot, registration feature, or fiducial.In some embodiments, the aligner device (and/or an LCF device) mayperform laser center finding (LCF) beam trajectories to perform LCF edgecapture for x-y alignment of the first process kit ring adaptor. In someembodiments, the aligner device may perform machine vision alignmentusing fiducials disposed on distal edges of a second upper surface ofthe first process kit ring adaptor to align the first process kit ringadaptor.

At block 910, the first process kit ring adaptor is removed (e.g.,lifted by the end effector of a factory interface robot) from the vacuumchuck (e.g., for first process kit ring replacement in a process chamberof the processing system). The features on the lower surface of thefirst process kit ring adaptor may interconnect with the recesses on theupper surface of the end effector and the friction pads on the lowersurface of the first process kit ring adaptor may come in contact withthe upper surface of the end effector.

At block 912, the first process kit ring adaptor is transported (e.g.,by the end effector) to a load lock station. The end effector may placethe first process kit ring adaptor on a support structure (e.g., liftpins interfacing with kinematic features on the lower surface of thefirst process kit ring adaptor, fins with recesses that interface withportions of the first process kit ring adaptor proximate the perimeterof the first process kit ring adaptor, etc.) of the load lock station.

At block 914, the first process kit ring adaptor is removed (e.g.,picked up by a transfer robot) from the load lock station. In someembodiments, an end effector of the transfer robot lifts the firstprocess kit ring adaptor from a support structure (e.g., lift pinsinterfacing with the kinematic features, fins interfacing with portionsproximate the perimeter, etc.) of the load lock station. The features onthe lower surface of the first process kit ring adaptor may interconnectwith the recesses on the upper surface of the end effector of thetransfer robot and the friction pads on the lower surface of the firstprocess kit ring adaptor may come in contact with the upper surface ofthe end effector of the transfer robot.

At block 916, the first process kit ring adaptor is aligned using alocal center finding (LCF) edge capture (e.g., via an LCF device). Insome embodiments, prior to a process kit ring adaptor being transferredinto a processing chamber and subsequent to the process kit ring adaptorbeing transferred out of a processing chamber, LCF edge capture is usedto align one or more of the process kit ring adaptor or a process kitring disposed on the process kit ring adaptor.

At block 918, the first process kit ring adaptor is transferred (e.g.,by the transfer robot) to the processing chamber.

At block 920, a first process kit ring (used) is placed from theprocessing chamber onto the first process kit ring adaptor. For example,the first process kit ring may be lifted (e.g., via lift pins of theprocessing chamber) and the first process kit ring adaptor disposed onan end effector (e.g., of the transfer robot) may be moved to be underthe first process kit ring adaptor. The lift rings may lower the firstprocess kit ring onto the process kit ring adaptor that is on the endeffector. The lift pins may be wafer lift pins. The lift pins may beprocessing kit ring lift pins. The end effector and the first processkit ring adaptor may be sized and shaped to not interfere with the liftpins. For example, the flat perimeter sides of the first process kitring adaptor may allow the lift pins to interface with the lower surfaceof the first process kit ring.

At block 922, the first process kit ring adaptor and the first processkit ring disposed on the first process kit ring adaptor are transferredfrom the processing chamber to the process kit enclosure system. Block922 may be similar to the reverse of blocks 902-918. For example, thefirst process kit ring disposed on the first process kit ring adaptormay be transferred by an end effector of a transfer robot, aligned viaLCF edge capture, placed on a load lock station, removed (e.g., via anend effector of a factor interface robot) from the load lock station,transported to the aligner device, placed on the vacuum chuck, rotatedto align one or more of the first process kit ring adaptor or the firstprocess kit ring, removed from the vacuum chuck, transferred to theprocess kit enclosure system, and placed on a slot (e.g., above theempty process kit ring adaptors, below the new process kit ringsdisposed on process kit ring adaptors).

Referring to FIG. 9B, at block 932, a second process kit ring adaptorwith a second process kit ring (new, unused) disposed on the uppersurface of the second process kit ring adaptor is removed (e.g., by anend effector) from the process kit enclosure system (e.g., from a slotabove one or more empty process kit ring adaptors and/or above one ormore used process kit rings each disposed on a corresponding process kitring adaptor). The second process kit ring adaptor may be disposed onfins (e.g., at two or more portions of the lower surface of the secondprocess kit ring adaptor proximate the perimeter of the second processkit ring adaptor) within the process kit enclosure system. Acorresponding upper surface of a distal end of each fin may form arecess that is shaped and sized to receive a corresponding portion ofthe perimeter of the second process kit ring adaptor. An end effector ofa robot arm (e.g., factory interface robot) of a processing system mayenter the process kit enclosure system below the second process kit ringadaptor between the fins on which the second process kit ring adaptor issupported. The end effector may lift to interface the upper surface ofthe end effector with a lower surface of the second process kit ringadaptor. The upper surface of the end effector may form recesses thatinterconnect with features (e.g., mechanical safety guides, protrusions,pin contacts, etc.) of the lower surface of the second process kit ringadaptor. The lower surface of the second process kit ring adaptor mayhave friction pads that contact the upper surface of the end effector.The end effector may lift the second process kit ring adaptor and secondprocess kit ring disposed on the second process kit ring adaptor.

The second process kit ring may be disposed on a first distal end and asecond distal end of the second process kit ring adaptor. A first uppersurface of the end effector may interface with a lower surface of thesecond process kit ring adaptor. The second process kit ring adaptor maybe disposed on fins of a process kit enclosure system (e.g., FOUP) andthe second process kit ring may be disposed on the second process kitring adaptor. The second process kit ring may be retained on the secondprocess kit ring adaptor in the process kit enclosure system via aretaining feature (e.g., extrusion of the fin) inserted between thesecond process kit ring and the second process kit ring adaptor. Thesecond process kit ring adaptor and second process kit ring may beremoved from the retaining feature by the end effector raising thesecond process kit ring adaptor in a vertical direction.

At block 934, the second process kit ring adaptor and second process kitring disposed on the second process kit ring adaptor are transported(e.g., by the end effector) to an aligner device.

At block 936, the second process kit ring adaptor and the second processkit ring disposed on the second process kit ring adaptor are placed(e.g., by the end effector) on a vacuum chuck of an aligner device. Thefriction pads on the lower surface of the second process kit ringadaptor may interface with the aligner device. A planar central regionof the lower surface of the second process kit ring adaptor interfaceswith the vacuum chuck. The end effector may place the second process kitring adaptor on the vacuum chuck by aligning the planar central regionof the second process kit ring adaptor above the vacuum chuck andlowering the planar central region of the second process kit ringadaptor on the vacuum chuck. The end effector may not cover the centralregion. The end effector may remain lowered below the second process kitring adaptor or may be removed from below the second process kit ringadaptor.

At block 938, the second process kit ring adaptor and the second processkit ring disposed on the second process kit ring adaptor are rotated bythe vacuum chuck to align the second process kit ring. The alignerdevice may scan for one or more of: the flat planar surface of the innersurface of the second process kit ring; a slot of the second process kitring adaptor proximate the flat planar surface of the inner surface ofthe second process kit ring; a protruding alignment feature of thesecond process kit ring adaptor proximate the flat planar surface of theinner surface of the second process kit ring; fiducials on the uppersurface of the second process kit ring adaptor; etc.

The aligner device may scan the second process kit ring to locate aregistration feature disposed on an inside edge of the second processkit ring to align the second process kit ring. The second process kitring adaptor is shaped to provide clearance between the inside edge ofthe second process kit ring and the second process kit ring adaptor suchthat a beam of a ribbon sensor will not be interrupted by the secondprocess kit ring adaptor and can detect the registration feature of thesecond process kit ring. In some embodiments, the aligner device mayperform laser center finding (LCF) beam trajectories to perform LCF edgecapture for x-y alignment of the second process kit ring adaptor. Insome embodiments, the aligner device may perform machine visionalignment using fiducials disposed on distal edges of a second uppersurface of the second process kit ring adaptor to align the secondprocess kit ring adaptor.

At block 940, the second process kit ring adaptor and second process kitring disposed on the second process kit ring adaptor are removed (e.g.,lifted by the end effector of a factory interface robot) from the vacuumchuck (e.g., for second process kit ring replacement in a processchamber of the processing system). The features on the lower surface ofthe second process kit ring adaptor may interconnect with the recesseson the upper surface of the end effector and the friction pads on thelower surface of the second process kit ring adaptor may come in contactwith the upper surface of the end effector.

At block 942, the second process kit ring adaptor and second process kitring disposed on the second process kit ring adaptor are transported(e.g., by the end effector) to a load lock station. The end effector mayplace the second process kit ring adaptor (e.g., with second process kitring disposed on the second process kit ring adaptor) on a supportstructure (e.g., lift pins interfacing with kinematic features on thelower surface of the second process kit ring adaptor, fins with recessesthat interface with portions of the second process kit ring adaptorproximate the perimeter of the second process kit ring adaptor, etc.) ofthe load lock station.

At block 944, the second process kit ring adaptor is removed (e.g.,picked up) by a transfer robot from the load lock station. In someembodiments, an end effector of the transfer robot lifts the secondprocess kit ring adaptor (e.g., with second process kit ring disposed onthe second process kit ring adaptor) from a support structure (e.g.,lift pins interfacing with the kinematic features, fins interfacing withportions proximate the perimeter, etc.) of the load lock station. Thefeatures on the lower surface of the second process kit ring adaptor mayinterconnect with the recesses on the upper surface of the end effectorof the transfer robot and the friction pads on the lower surface of thesecond process kit ring adaptor may come in contact with the uppersurface of the end effector of the transfer robot.

At block 946, one or more of the second process kit ring adaptor or thesecond process kit ring are aligned using LCF edge capture.

At block 948, the second process kit ring adaptor and the second processkit ring disposed on the second process kit ring adaptor are transferred(e.g., by the transfer robot) to the processing chamber.

At block 950, the second process kit ring is lifted (e.g., via liftpins) off of the second process kit ring adaptor in the processingchamber. The lift pins may be wafer lift pins. The lift pins may beprocessing kit ring lift pins. The end effector and the second processkit ring adaptor may be sized and shaped to not interfere with the liftpins. For example, the flat perimeter sides of the second process kitring adaptor may allow the lift pins to interface with the lower surfaceof the second process kit ring.

At block 952, the empty second process kit ring adaptor is transferredfrom the processing chamber to the process kit enclosure system.transferred from the processing chamber to the process kit enclosuresystem. Block 952 may be similar to the reverse of blocks 932-948. Forexample, the second process kit ring adaptor may be transferred (e.g.,by an end effector of the transfer robot) and aligned via LCF edgecapture. The transfer robot may transfer the empty second process kitring adaptor to a load lock station. The end effector of the factoryinterface robot may lift the empty second process kit ring adaptor fromthe load lock station. The load lock station and end effector of thefactory interface robot may interface with the empty second process kitring adaptor in the same or a similar manner as when a second processkit ring is disposed on the second process kit ring adaptor. The secondprocess kit ring adaptor may be transported to the aligner device,placed on the vacuum chuck, rotated to align the second process kit ringadaptor, removed from the vacuum chuck, and transferred to the processkit enclosure system.

In some embodiments, at block 952, the empty second process kit ringadaptor is placed in the process kit enclosure system by the endeffector of the factory interface robot. The end effector may enter theprocess kit enclosure system above a set of fins (e.g., the end effectorbeing aligned with a gap between the fins and the end effector may lowerto place the empty second process kit ring adaptor on the fins.

In some embodiments, one or more end effectors may remove a used thirdprocess kit ring lifted on lift pins in a processing chamber byinserting the second process kit ring adaptor disposed on an endeffector under the used third process kit ring while the lift pins lower(to dispose the used third process kit ring on the second process kitring adaptor), extract the third process kit ring disposed on the secondprocess kit ring adaptor on the end effector from the processingchamber, aligning one or more of the third process kit ring or thesecond process kit ring adaptor via LCF edge capture and/or the alignerdevice, inserting the third process kit ring disposed on the secondprocess kit ring adaptor into the process kit enclosure system, loweringthe end effector, and extracting the end effector from the process kitenclosure system.

One or more end effectors may transport a process kit ring adaptor andprocess kit ring to a processing chamber. An end effector may beinserted under a process kit ring disposed on the process kit ringadaptor in the process kit enclosure system, lifted to lift the processkit ring disposed on the process kit ring adaptor, and extracted fromthe process kit enclosure system. An end effector may insert the processkit ring disposed on the process kit ring adaptor into a processingchamber (e.g., where a used process kit ring was removed), lift pins mayraise to lift the process kit ring off of the process kit ring adaptor,the end effector may extract the process kit ring adaptor from theprocessing chamber, and the lift pins may lower to place the process kitring into position in the processing chamber.

The preceding description sets forth numerous specific details such asexamples of specific systems, components, methods, and so forth in orderto provide a good understanding of several embodiments of the presentdisclosure. It will be apparent to one skilled in the art, however, thatat least some embodiments of the present disclosure may be practicedwithout these specific details. In other instances, well-knowncomponents or methods are not described in detail or are presented insimple block diagram format in order to avoid unnecessarily obscuringthe present disclosure. Thus, the specific details set forth are merelyexemplary. Particular implementations may vary from these exemplarydetails and still be contemplated to be within the scope of the presentdisclosure.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment. Thus, the appearances of the phrase “in oneembodiment” or “in an embodiment” in various places throughout thisspecification are not necessarily all referring to the same embodiment.In addition, the term “or” is intended to mean an inclusive “or” ratherthan an exclusive “or.” When the term “about” or “approximately” is usedherein, this is intended to mean that the nominal value presented isprecise within ±10%.

Although the operations of the methods herein are shown and described ina particular order, the order of operations of each method may bealtered so that certain operations may be performed in an inverse orderso that certain operations may be performed, at least in part,concurrently with other operations. In another embodiment, instructionsor sub-operations of distinct operations may be in an intermittentand/or alternating manner.

It is understood that the above description is intended to beillustrative, and not restrictive. Many other embodiments will beapparent to those of skill in the art upon reading and understanding theabove description. The scope of the disclosure should, therefore, bedetermined with reference to the appended claims, along with the fullscope of equivalents to which such claims are entitled.

What is claimed is:
 1. A process kit ring adaptor comprising: a rigidcarrier comprising: an upper surface comprising a first distal portionand a second distal portion to support a process kit ring; and a lowersurface comprising a first region to interface with an end effectorconfigured to support wafers, wherein the lower surface furthercomprises a solid planar central region configured to interface with avacuum chuck, and wherein the process kit ring adaptor supporting theprocess kit ring is configured to be transported on the end effectorwithin a processing system.
 2. The process kit ring adaptor of claim 1,wherein: the upper surface is approximately planar; the process kit ringis to stack on top of the upper surface that is approximately planar;and the rigid carrier further comprises two or more pin contactsdisposed on the upper surface proximate the first distal portion toprevent horizontal movement of the process kit ring.
 3. The process kitring adaptor of claim 2, wherein the two or more pin contacts furtherprevent rotation of the process kit ring.
 4. The process kit ringadaptor of claim 2, wherein: each of the two or more pin contactscomprises a sloped sidewall that has a first coefficient of friction toallow the process kit ring to slide to a target position at the firstdistal portion of the upper surface of the rigid carrier; and the firstdistal portion has a second coefficient of friction that is greater thanthe first coefficient of friction to prevent the horizontal movement ofthe process kit ring.
 5. The process kit ring adaptor of claim 1 furthercomprising: a plurality of friction pads disposed on the lower surfaceof the rigid carrier to interface with a first upper surface of thevacuum chuck or a second upper surface of the end effector to avoidhorizontal movement of the process kit ring adaptor relative to thevacuum chuck or the end effector.
 6. The process kit ring adaptor ofclaim 1, wherein the rigid carrier comprises: a plate; and a firstreinforcement structure disposed on the plate, wherein the firstreinforcement structure extends from the first distal portion of therigid carrier to the second distal portion of the rigid carrier that isopposite the first distal portion.
 7. The process kit ring adaptor ofclaim 6, wherein: the first distal portion of the rigid carrier is afirst distal end of the first reinforcement structure; the second distalportion of the rigid carrier is a second distal end of the firstreinforcement structure; the first distal end of the first reinforcementstructure forms a first notch to receive the process kit; and the seconddistal end of the first reinforcement structure forms a second notch toreceive the process kit.
 8. The process kit ring adaptor of claim 1,wherein: the lower surface comprises a distal end that is a guide taperto interface with the end effector or forms a recess to engage with theend effector.
 9. The process kit ring adaptor of claim 1 furthercomprising: one or more of a slot formed by the process kit ringadaptor, a protruding alignment feature, or fiducials disposed on theupper surface of the rigid carrier to facilitate machine visionalignment of the process kit ring adaptor.
 10. The process kit ringadaptor of claim 1, wherein: the process kit ring adaptor comprises oneor more lift pin interfaces that align with carrier lift pins that areconfigured to lift wafers; and the process kit ring adaptor is shaped tosupport the process kit ring while avoiding is configured to avoidinterference with process kit ring lift pins that are to lift theprocess kit ring off of the process kit ring adaptor.
 11. The processkit ring adaptor of claim 1, wherein: the process kit ring adaptor isconfigured to provide a gap between a) an inner sidewall of the processkit ring that comprises a registration feature sidewall and b) theprocess kit ring adaptor such that a beam of a ribbon sensor will not beinterrupted by the rigid carrier and can detect the registration featuresidewall of the process kit ring.
 12. A process kit ring adaptorcomprising: a first reinforcement structure comprising a first distalend and a second distal end for supporting a process kit ring; and avacuum interface structure, coupled to a lower surface of the firstreinforcement structure, forming a solid planar lower surface tointerface with a vacuum chuck, wherein the process kit ring adaptorsupporting the process kit ring is configured to be transported on anend effector within a processing system.
 13. The process kit ringadaptor of claim 12 further comprising: a support structure, wherein theprocess kit ring is to be disposed on the support structure and thesupport structure is disposed on the first distal end and the seconddistal end, wherein the support structure forms a circular insideperimeter and an outside perimeter, and wherein the outside perimetercomprises a first curved edge, a second curved edge opposite the firstcurved edge, a first parallel edge, and a second parallel edge parallelto the first parallel edge.
 14. The process kit ring adaptor of claim12, wherein the first distal end forms a first notch and the seconddistal end forms a second notch, wherein the process kit ring is to beembedded in the first notch and the second notch.
 15. The process kitring adaptor of claim 12 further comprising protrusion structures,structurally coupled to the first reinforcement structure and the vacuuminterface structure, to interface with the end effector configured tosupport wafers.
 16. The process kit ring adaptor of claim 12 furtherforming receptacle structures, structurally coupled to the firstreinforcement structure and the vacuum interface structure, to interfacewith carrier lift pins that are configured to lift wafers.
 17. A methodcomprising: lifting, using an end effector on a robot arm of aprocessing system, a process kit ring adaptor and process kit ringdisposed on a first distal end and a second distal end of the processkit ring adaptor, wherein a first upper surface of the end effectorinterfaces with a lower surface of the process kit ring adaptor;placing, using the end effector, the process kit ring adaptor on avacuum chuck, wherein a planar central region of the lower surface ofthe process kit ring adaptor interfaces with the vacuum chuck; rotating,using the vacuum chuck, the process kit ring adaptor and the process kitring to align the process kit ring; and lifting, using the end effector,the process kit ring adaptor and the process kit ring from the vacuumchuck for process kit ring replacement in a process chamber of theprocessing system.
 18. The method of claim 17 further comprising:scanning the process kit ring to locate a registration feature disposedon an inside edge of the process kit ring to align the process kit ring,wherein the process kit ring adaptor is shaped to provide clearancebetween the inside edge of the process kit ring and the process kit ringadaptor such that a beam of a ribbon sensor will not be interrupted bythe process kit ring adaptor and can detect the registration feature ofthe process kit ring.
 19. The method of claim 17 further comprising:retaining the process kit ring on the process kit ring adaptor in aprocess kit enclosure system via a retaining feature inserted betweenthe process kit ring and the process kit ring adaptor.
 20. The method ofclaim 17 further comprising one or more of: performing laser centerfinding (LCF) beam trajectories to perform LCF edge capture for x-yalignment of the process kit ring adaptor; or performing machine visionalignment using fiducials disposed on distal edges of a second uppersurface of the process kit ring adaptor to align the process kit ringadaptor.